Stamping

Basic Function & Stamping Heat Sinks

Basic Stamping Heat Sinks provide an economical solution to low power density thermal problems. They include BGA, simple Stamping heat sinks. Stamping is a high volume manufacturing techniques, and it can ensure the lowest cost.


Why Basic Function & Stamping Heat Sinks?

Lowest cost thermal solutions

Ideal for Printed Circuit Boards

Simple assembly processing and reduce cost

Easy manufacturing process

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Technical support: Shenzhen Baida Technology