Basic Function & Stamping Heat Sinks
Basic Stamping Heat Sinks provide an economical solution to low power density thermal problems. They include BGA, simple Stamping heat sinks. Stamping is a high volume manufacturing techniques, and it can ensure the lowest cost.
Why Basic Function & Stamping Heat Sinks?
Lowest cost thermal solutions
Ideal for Printed Circuit Boards
Simple assembly processing and reduce cost
Easy manufacturing process
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